Bergquist has extended its family of S-class low-modulus gap pad materials optimised for high thermal performance by introducing Gap Pad 1500S30, which achieves thermal conductivity 1.3W/m-K and bulk-hardness rating 30 (Shore 00). The new formulation increases choice for designers seeking efficient heat removal from fragile components in cost-sensitive applications..

Recent innovations in efficient, easy-to-use thermal interface materials and insulated metal substrates are helping companies reduce component count, bills-of-materials, assembly processes and overall product dimensions. Convenient thermal pads and fillers are also letting manufacturers reduce stockholding
and simplify inventory management. These are the claims of
The Bergquist Company’s European marketing manager,
Nico Bruijnis: read on to discover more. .